As Staff Engineer Process Block Base Material and Thinning you are accompanying the introduction of processes and methods for new base-materials like Si, SiC- or GaN as well as the definition and development of various integration schemes for wafer-backside processing.
Thus, you are enabling the next generation of power semiconductor technologies of Infineon. With putting focus on reduction and avoidance of complexity you also contribute thoroughly to Infineon business results.
Your new responsibilities will be :
You are best equipped for this task if you :
We offer competitive salaries and additional benefits based on your performance, experience and qualification. The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https : / / www.
feei.at / leistungen / informations-service / mindestlohne-und-gehalter-2020). The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills.