Your tasks and responsibilities
Technology development for advanced 3D integration concepts in close cooperation with external partners
Providing the interface to external partners and tracking the completion of the project related tasks in accordance with the project plan
Leading work packages and project sub-teams
Characterization of the technology by test, analysis and work out in conclusive reports
Submitting new innovative process and device concepts as patent proposals
Working in team-oriented atmosphere with a strong focus on thorough documentation and completing of projects timely and successfully
Setting expectations by updated and detailed work plans. Identifying gaps, issues and needs to resolve and to successfully complete projects
Applying problem solving methods (like 8D, Fishbone, etc.) and risk analysis (like FMEA)
Efficient and effective reporting to stakeholders to maintain commitments
Your education and experiences
Advanced university degree in physics, chemistry or related university study
3 years of work experience in wafer level integration, 3D processes (TSV), MEMS, die stacking and related technologies
Very good knowledge of wafer processing with emphasis on process module development and integration
Good English skills spoken and written and good reporting style
Collective salary and wage agreement
We offer competitive salaries and additional based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G .
We offer a higher compensation depending on your expertise and skills.