Process R&D Engineer Wafer Level Integration (m/f/d)
ams AG
Austria
vor 4 Tg.

Your tasks and responsibilities

  • Technology development for advanced 3D integration concepts in close cooperation with external partners
  • Providing the interface to external partners and tracking the completion of the project related tasks in accordance with the project plan
  • Leading work packages and project sub-teams
  • Characterization of the technology by test, analysis and work out in conclusive reports
  • Submitting new innovative process and device concepts as patent proposals
  • Working in team-oriented atmosphere with a strong focus on thorough documentation and completing of projects timely and successfully
  • Setting expectations by updated and detailed work plans. Identifying gaps, issues and needs to resolve and to successfully complete projects
  • Applying problem solving methods (like 8D, Fishbone, etc.) and risk analysis (like FMEA)
  • Efficient and effective reporting to stakeholders to maintain commitments
  • Your education and experiences

  • Advanced university degree in physics, chemistry or related university study
  • 3 years of work experience in wafer level integration, 3D processes (TSV), MEMS, die stacking and related technologies
  • Very good knowledge of wafer processing with emphasis on process module development and integration
  • Team player
  • Good English skills spoken and written and good reporting style
  • Collective salary and wage agreement

    We offer competitive salaries and additional based on your performance, experience and qualification.

    The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G .

    We offer a higher compensation depending on your expertise and skills.

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